Feature: | Heat-Resistant | Name: | Double Sided Thermal Adhesive Tape |
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Standard Size: | 25mm X 25M | Heat Resistance: | 120 C |
Die Cut: | Supply | Adhesive Type: | Pressure Sensitive |
Material: | Acrylic | Thermal Conductivity: | 0.5W/m-K |
Highlight: | 1.0W/m.K Double Sided Thermal Adhesive Tape,Heat Resistant Thermal Adhesive Tape,acrylic Double Sided Thermal Adhesive Tape |
Heat-Resistant Double Sided Thermal Adhesive Tape 1.0W/m.K
Configuration of thermal adhesive tape
Sheet form/roll form/die-cut parts
Feature
High tacky thermal conductive PSA.
Only pressure is needed to form an excellent bond and thermal interface.
The performance of thermal conductivity, insulation, buffer and high tacky make it as the best choice for electronic application.
Flexible and conformable. Ideal for uneven surfaces.
Stable and economical with different thicknesses and constructions.
Available thickness of thermal adhesive tape
M-TS010 double sided thermal adhesive tape typical properties |
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Reinforced Material |
Fiberglass |
Fiberglass |
Fiberglass |
Fiberglass |
Fiberglass |
Fiberglass |
Fiberglass |
Thickness |
0.1mm |
0.15mm |
0.2mm |
0.25mm |
0.3mm |
0.4mm |
0.5mm |
Peel Strength (PSTC-101)(N/25mm) |
>13.72 |
>13.72 |
>13.72 |
>13.72 |
>13.72 |
>13.72 |
>13.72 |
Temp Resistance(S) °C (°F) |
180 (356) |
180 (356) |
180 (356) |
180 (356) |
180 (356) |
180 (356) |
180 (356) |
Temp Resistance(L)°C (°F) |
120 (248) |
120 (248) |
120 (248) |
120 (248) |
120 (248) |
120 (248) |
120 (248) |
Continues Use. Temp. (°C) |
-20 to 120 |
-20 to 120 |
-20 to 120 |
-20 to 120 |
-20 to 120 |
-20 to 120 |
-20 to 120 |
Adhesion |
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Retention |
>48 |
>48 |
>48 |
>48 |
>48 |
>48 |
>48 |
Adhesion(Kg/Inch) |
1.1 |
1.4 |
1.4 |
1.4 |
1.4 |
1.4 |
1.4 |
Initial Bonding |
0.6 |
1.3 |
1.3 |
1.3 |
1.3 |
1.3 |
1.3 |
Electrical |
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Breakdown Voltage |
2 |
2.5 |
3.5 |
4.0 |
6.0 |
6.7 |
7.0 |
Thermal |
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Thermal conductivity |
1.0W/M.K |
1.0W/M.K |
1.0W/M.K |
1.0W/M.K |
1.0W/M.K |
1.0W/M.K |
1.0W/M.K |
Thermal conductive tape application
1, For CPU, LED, PPR heat sink,microprocessor
2, Fixing heat sink on the power supply circuit board
3, Fixing heat sink on vehicle control circuit board
4, Replacing screws,fasteners and other fix means
Detailed Images
Packing & Shipping
FAQ
Q:What’s the thermal conductivity test method given on the data sheet?
A: All the data in the sheet are tested out by the third party. ASTM D5470 is utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for your application?
A: It depends on the watts of power source, ability of heat dissipation. For any customers, please contact us for the technical support.
Q: Are thermal pads reworkable?
A: It’s depend on the application and the pad being used. Thermal pads have been reused before, however,it’s up to the judgment of product designer, to see whether the pads could withstand reuse.