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Silicone Free 2.6 G/Cm3 2.5W/M.K Thermally Conductive Gel For IC

Basic Information
Place of Origin: Guangdong,China
Certification: ROHS
Model Number: M-NTN250
Minimum Order Quantity: Negotiation
Price: Negotiation
Packaging Details: Packed in Carton
Delivery Time: 5~8 Days
Payment Terms: T/T
Supply Ability: 100000PCS
Detail Information
Other Names: Polypropylene Usage: Thermal Conduction
Density: 2.6 G/cm3 Working Temp: -50 ~ 150 Degree Celsius
Thermal Conductivity: 2.5W/m.K Viscosity 0.5rpm: 5000Pas
Main Raw Material: Polyolefin Polymer Classification: Other Adhesives
High Light:

2.6g/cm3 thermal conductive putty

,

2.6g/cm3 thermally conductive gel

,

2.5W/m.K thermally conductive gel


Product Description

2.5W/mK Density 2.6 g/cm3 Non-Silicone High thermal conductive putty Used For IC

 

Product Description
 
   This thermally-conductive liquids are specifically designed to support optimized dispensing control with excellent thermal and mechanical performance. Dispensed in a liquid state, the material creates virtually zero stress on components during assembly It can be used to interface and conform to the most intricate topographies andmultilevel surfaces. They provide infinite-thickness coverage for uneven board topography.

 

Features

 

Silicone-free type spacer

High thermal conductivity

High compressibility

Very low thermal resistnce

Best for north bridge IC

 

Applications

 

Electronic components: IC, CPU, MOS

LED, M/B, P/S, Heat Sink,

LCD-TV, Notebook PC, PC, Telecom Device, Wireless Hub…..etc

DDR ll Module, DVD Applications, Hand-set applications…..etc

 

Properties

 

 

Reliability

         

 

Thermal Impedance

 

Initial

 

200 Hr

 

400 Hr

 

700 Hr

 

1000Hr

 

125°C Aging

 

0.052

 

0.053

 

0.052

 

0.053

 

0.054

 

85°C/85% RH

 

0.052

 

0.051

 

0.050

 

0.051

 

 

0.052

 

 

 

Physical Properties

 

M-TN250

 

Unit

 

Tolerance

 

Test Method

 

Thermal Conductivity

 

2.5

 

W / mK

 

±0.25

 

ASTM D5470

 

Color

Gray

 

-

 

-

 

Visual

 

Solid Content

 

100

 

%

 

-

-

 

Viscosity 0.5rpm

 

5000

 

Pa·s

 

-

 

Brookfield

 

Density

 

2.6

 

g / cm3

 

-

 

ASTM D792

 

Low MW Siloxane (D3-10)

 

0

 

ppm

 

-

 

GC/MS

 

TML

 

0.2

 

%

 

-

 

ASTM E595

 

CVCM

 

0.1

 

%

 

-

 

ASTM E595

 

Volume Resistivity

 

1014

 

Ohm-m

 

-

 

ASTM D257

 

Working Temp.

 

-50 ~ 150

 

°C

 

-

 

-

 

Standard package

 

78g/ 143g/ 1KG

 

Tube/Pot

 

-

 

-

 
 
 
Product Usages
Silicone Free 2.6 G/Cm3 2.5W/M.K Thermally Conductive Gel For IC 0
 

 

 

Product Detail

 

Silicone Free 2.6 G/Cm3 2.5W/M.K Thermally Conductive Gel For IC 1Silicone Free 2.6 G/Cm3 2.5W/M.K Thermally Conductive Gel For IC 2

 

 

 

Packing & Shipping

 

 

 

Silicone Free 2.6 G/Cm3 2.5W/M.K Thermally Conductive Gel For IC 3

 

FAQ

 

1. What are your main products?
We supply thermally conductive pad, graphene Material, thermal adhesive tape, thermally double component silicone, thermally conductive materials, phase change thermal interface materials, thermally conductive insulators and thermal grease. Samples of silicone thermally conductive sheet are available, but the freights need to be paid by the buyers.

 

2. What about the product quality and which certificate do you have?
We have UL certificate,ISO9001,ISO14001 and ROHS certificate.

 

3. How long does it take to deliver after order?
For small quantity, we arrange delivery within one week normally while for big quantity, we will arrange delivery as soon as
possible according to actual situation and customer's requirements.

 

4. What about your after-sale service?
We fully guarantee our product quality and will provide free technical guidance on operations.

Contact Details
sales

Phone Number : +8613560312553

WhatsApp : +8613560312553