products

3.1g/Cm3 3.5W/M.K Heatsink Thermal Paste For Construction

Basic Information
Place of Origin: Guangdong,China
Certification: ROHS
Model Number: M-TN350
Minimum Order Quantity: Negotiation
Price: Negotiation
Packaging Details: Packed in Carton
Delivery Time: 5~8 Days
Payment Terms: T/T
Supply Ability: 100000PCS
Detail Information
Main Raw Material: Metal Oxide+silicone Density: 3.10±0.31 G/cm 3
Hardness: N/A Shore OO Classification: Other Adhesives
Usage: Construction, Electronics Dielectric Strength: ≥8.0 Kv/mm
Thermal Conductivity: 3.50±0.35 W/m K
High Light:

3.5W/M.K heatsink thermal paste

,

3.1g/cm3 heat conductive putty

,

3.5W/M.K thermally conductive putty


Product Description

Thermal Conductivity Thermal Putty for High Thermal Insulation Sealing Material

 

Product Description
 

    M-TN350 thermal putty is a kind of thermal interface materials which has a very low force deformation. It has a good plasticity as plasticine. It is suitablefor the radiating modules or components which with a big change of thickness. It has inherent adhesion features, dispense with adhesion layer, meanwhile keep wettability and cover the tiny uneven surface so that make the mating parts fully contacted, thus improve the efficiency of heat conduction.

Different from thermal silicone grease, there is no sedimentation phenomenon for M-TN350 thermal putty . It is suitable for screen printing or coating. The thickness can be specially customized.

 

Features and Benefits


Thermal Conductivity 3.5 W/m·k
Good plasticity and can take place of thermal grease
Very good wettability which reducing the thermal resistance
Flame Retardant Grade: V-0

 

Physical Properties

 

 

Property

 

Unit

 

Specifications

 

Test Standard

 

Appearance

 

-

 

Pink

 

Visual inspection

Extrusion rate g/min 30 30cc Syringe &
0.1”Needle
@90psi

 

Hardness

 

Shore OO(at 3 second delay)

 

N/A

 

ASTM D 2240

 

Extractable Silicone

 

%

 

≤6

 

ASTM G120-01

 

Thermal conductivity

 

W/m·K

 

3.5±0.35

 

ASTM D5470

 

Thermal resistance

 

@ 20 psi

0.08°C·in2/W
0.51°C·cm2/W

 

ASTM D5470

 

Flame Rating

- 94 V-0 U.L.

 

Breakdown Voltage

kV(@1m
m)

 

>10.0

 

ASTM D149

 

Volume

 

Ω·cm

1.0×1014

 

ASTM D257

 

Density

 

g/cm3

 

3.1±0.31

 

ASTM D792

Permeability 
TML (CVCM)

 

%

 

≤0.15 (0.05

 

ASTM E595

Continuous
service
temperature

 

°C

 

-60 to 200

 

***

 

RoHS Compliant

 

-

 

Yes

 

***

 

 Applications 

Mobile Communication Equipment 
Flat Panel and Multimedia Equipment 
Desktop computers, portable computers and servers 
LED lighting equipmentLED 
Printed Circuit Board Components, Shell Connection 
Optical Fiber Communication Equipment 
Automotive Electronic Products 
Fragile/Fragile Components, Shell Connections
Military Electronic Equipment 
 
Detailed Picture
 
3.1g/Cm3 3.5W/M.K Heatsink Thermal Paste For Construction 0
 
Product Usages
 
3.1g/Cm3 3.5W/M.K Heatsink Thermal Paste For Construction 1

 

 

Packing & Shipping

 

3.1g/Cm3 3.5W/M.K Heatsink Thermal Paste For Construction 2

 

 

 

FAQ

 

1. What are your main products?
We supply thermally conductive pad, graphene Material, thermal adhesive tape, thermally double component silicone, thermally conductive materials, phase change thermal interface materials, thermally conductive insulators and thermal grease. Samples of silicone thermally conductive sheet are available, but the freights need to be paid by the buyers.

 

2. What about the product quality and which certificate do you have?
We have UL certificate,ISO9001,ISO14001 and ROHS certificate.

 

3. How long does it take to deliver after order?
For small quantity, we arrange delivery within one week normally while for big quantity, we will arrange delivery as soon as
possible according to actual situation and customer's requirements.

 

4. What about your after-sale service?
We fully guarantee our product quality and will provide free technical guidance on operations.

Contact Details
sales

Phone Number : +8613560312553

WhatsApp : +8613560312553