Grey 3W/M.K 5.5Kgf/Cm2 Thermal Conductive Silicone Pad

Basic Information
Place of Origin: Guangdong,China
Certification: ROHS,UL,REACH
Model Number: M-TP300
Minimum Order Quantity: Negotiation
Price: Negotiation
Packaging Details: Packed in Carton
Delivery Time: 3~7Days
Payment Terms: T/T
Supply Ability: 10000Pieces/Day
Detail Information
Feature: Electrical Performence Sample: Freely Supplied
Color: White,Grey Rated Voltage: 6Kv/ac
Material: Thermal Interface Pad Application: LED
Size: 200*400mm. Customized Accepted Product Name: Factory Produce Thermal Pad Price
High Light:

3W/M.K carbon thermal pad


5.5Kgf/cm2 carbon thermal pad


5.5Kgf/cm2 Thermal Conductive Silicone Pad

Product Description

3W/M.K Grey Silicone Conductive Carbon Thermal Pad For LED Lighting


Heat Transfer Thermal Pad Description


1.Thermal pads are designed as a heat transfer gap filler to fulfil the heat transfer between heat generating and cooling devices.


2.Thermal pads are also insulating and anti-damping and can seal the gaps


3.Different thickness range and thermal conductivity for different requirements.


Heat Transfer Thermal Pad Features


1.Thermal conductivity: 3.0w/m-k

2.Size available: 200mm x 400mm, 300mm x 300mm, special size could be provided


4.Electrical isolating

5.Flame retarding: V-0


7.Color: colorful

8.Thermal conductivity: 0.5W/M-K, 1.0W/M-K, 1.5W/M-K, 2.0W/M-K, 2.5W/M-K, 3.0W/M-K,4.0W/M-K

9.Hardness: 30 Shore C, 40 Shore C (Regular), 60 Shore C


Heat Transfer Thermal Pad Features




Polyester Release Film



Silicone Pad (Inherently Tacky)


Polyester Release Film




Heat Transfer Thermal Pad Application


1.Power supply,powder inverter product,heat module

2.DVD, VCD, CPU, IC, MOS filling material

3.LED, LCD-TV, PC, Notebook, Telecom devices

4.for electronic product such as laptop, motor, control board, solar, medical, automotive, smart phone, wireless devices etc


Heat Transfer Thermal Pad Application Mode


1. Filling between PCB and heat sink

2. Filling between IC and heat sink or outer cover

3. Filling between IC and other cooling material

Heat Transfer Thermal Pad Physical Property:


Product Properties







Test Value


Test Method


Specific Gravity










Shore A




ASTM D2240


Thermal Conductivity






ASTM D5470


Fire Retardant Rating








Specific Inductive Capacity (SIC)








Dielectric Breakdown






ASTM D1458


Voltage Withstand








Thermal Impedance






ASTM D5470


Temperature Resistance








Tension Changes








Extension Changes








Volume Changes






24 hr/25°C










Product Details


Grey 3W/M.K 5.5Kgf/Cm2 Thermal Conductive Silicone Pad 0

Grey 3W/M.K 5.5Kgf/Cm2 Thermal Conductive Silicone Pad 1



Product Application

Grey 3W/M.K 5.5Kgf/Cm2 Thermal Conductive Silicone Pad 2


Application Guidelines


1.) Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketene (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.


Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.


2.) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.


3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrates.




Q1: What's the thermal conductivity test method given on the data sheet ?

A1: All the data in the sheet are tested out by the third party. ASTM D5470 is utilized to test the thermal conductivity.
Q2: How to find a right thermal conductivity for my
application ?
A2: It depends on the watts of power source , ability of heat dissipation .
Q3: Do you accept custom orders ?
A3:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q4: Do you offer free samples ?
A4: Yes, we are willing to offer free sample but pls kindly note that your side pay for freight .

Q5: How to ship the orders ?
A5: We will help to arrange transportation for you . If you want to use your own courier account pls
kindly tell us before shipping out.
Q6: What's the leading time ?
A6: Sample order costs 1~3 workdays and 3~7 workdays for mass production.

Contact Details

Phone Number : +8613560312553

WhatsApp : +8613560312553