| Place of Origin: | Guangdong,China |
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| Certification: | ROHS,UL,REACH |
| Model Number: | M-TP350 |
| Minimum Order Quantity: | Negotiation |
| Price: | Negotiation |
| Packaging Details: | Packed in Carton |
| Delivery Time: | 3~7Days |
| Payment Terms: | T/T |
| Supply Ability: | 1000000Pieces/Day |
| Conductivity: | 1.0-10.0W/M-K | Rated Voltage: | 6KV |
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| Type: | Insulation Sheet | Color: | White,Blue,Pink,Grey |
| Size: | 200*400mm. Customized Accepted | Material: | Polyimide |
| Product Name: | Thermal Silicone Rubber Pad For Heat Press Machine | Sample: | Freely Supplied |
| Highlight: | 3.5W/M.K Thermal Conductive Silicone Pad,200mm width heat sink rubber pads,3.5W/M.K heat sink rubber pads |
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Blue 3.5W/M.K Ultra Soft Thermal Silicon Conductive Rubber Pads
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Name
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Thermal conductive silicone pad
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Color
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Customized(Grey,Black,White,Pink,Blue Etc)
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Thickness
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0.3,0.5,1,1.5,2(mm)
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Length
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2-400mm(customized)
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Width
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200mm(customized)
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Conductivity
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3.5w
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Temperature
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-45~+220 Degree Celsius
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| Feaute |
1. Low price with best quality,high thermal conductivity with low thermal resistance; |
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2. Natural stickiness, soft and flexible; |
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3. High electrical insulation can protect electronic devices; |
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4. Easy instalaction and easy use; |
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5. ROHS UL compliant |
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| Application |
1. Modle of high thermal conductivity requirements; |
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2. New energy vehicles; |
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3. Microprocessors,memory chips and graphics processors; |
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4. Network communications equipment; |
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5. Car equipment and charger; |
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6. High-speed hard disk drive. |
Application Guidelines
1.) Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketene (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.
2.) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.
3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrates.
Product Details
Packaging & Shipping
Q1: What's the thermal conductivity test method given on the data sheet ?
