| Place of Origin: | Guangdong,China |
|---|---|
| Certification: | ROHS |
| Model Number: | M-TG |
| Minimum Order Quantity: | Negotiation |
| Price: | Negotiation |
| Packaging Details: | Packed in Carton |
| Delivery Time: | 5~8 Days |
| Payment Terms: | T/T |
| Supply Ability: | 1000 Kilogram/Kilograms per Week |
| Main Raw Material: | Silicone | Construction & Compostion: | Metal Oxide Filled Silicone Oil |
|---|---|---|---|
| Color: | Gray | Other Names: | Silicon Grease |
| Mf: | Mixture | Thermal Conductivity: | 1.0~6.0 W/mk |
| Application: | Electronics,sealing Construction,printer | Shelf Life: | 24 Months |
| Highlight: | 3.0W/m.k heatsink thermal paste,3.0W/m.k thermal conductive silicone grease,3g/cm3 silicone heat sink paste |
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Automatic Dispensing Thermally Conductive Grease 3.0W Silicone Heat Sink Grease
Product Description
|
Test Item |
Test Method | Unit | TG120 | TG200 | TG300 | TG380 | TG500 |
|
Color |
Visual | - | White | White | Gray | Gray | Gray |
|
Specific Gravity |
ASTM D792 | g/cm3 | 2.1 | 2.4 | 3 | 3.2 | 3.38 |
|
Continuous Use Temp |
EN344 | ℃ | -40~+200 | -40~+200 | -40~+200 | -40~+200 | -40~+200 |
|
Weight Loss |
@150℃240H | % | ≤1.0 | ≤1.0 | ≤0.5 | ≤0.5 | ≤0.5 |
|
Breakdown Voltage |
ASTM D149 | KV/mm | ≥10 | ≥10 | ≥8 | ≥8 | ≥8 |
|
Volume Resistivity |
ASTM D257 | Ω·cm | 1×1015 | 9×1015 | 1×1015 | 3×1015 | 9×1015 |
|
Dielectric Constant |
ASTM D150 | @1MHz | 4.42 | 5.78 | 5.88 | 6.79 | 6.1 |
|
Dielectric Loss |
ASTM D150 | @1MHz | 0.00205 | 0.00649 | 0.00358 | 0.00813 | 0.00767 |
|
Thermal Conductivity |
ISO 22007-2 | W/m·K | 1.2 | 2 | 3 | 3.8 | 5 |
|
Thermal Impedance |
ASTM D5470 | ℃-in2/W | 0.15 | 0.05 | 0.015 | 0.012 | 0.009 |
M-TG thermal grease has good thermal conductive performance and reliability and can wet the surface of copper and aluminum which is extremely suit for the heat transfer of the CPU, GPU and other heating power components. As M-TG series has low adhesion, can fully wet the surface, form very low surface thermal resistance, it can quickly transfer the heat to cooling device. Just paste the grease on the gap between the power components and cooling device to help dismiss the air gap and enlarge the heat flow, decrease thermal resistance, reduce the temperature of power components, improve reliability and extend the usage life
Typical Applications
1.Between Semiconductor and heatsink
2.Between CPU and heatsink
3.Between power resistor and base
4.Thermoelectric cooler
5.The surface of temperature regulator and assembly
6.High-power LED lighting
Product Description
Notes
1. Keep surface cleaning: cleaning the sticklied and coated surface, remove the rust, dirt and oil.
2. Brush the glue: Unscrew the hose cap , pushed the glue to clean the surface, evenly make it natural flow.
A1:All the data in the sheet tested out by the third partly,ASTM D5470 is utilized to test the thermal conductivity.
Q2:How to find a right thermal conductivity for my application?
Q4:Do you offer free samples?
A4:Yes,we are willing to offer free sample but pls kindly note that your side pay for freight.
Q5:How to ship the orders?
A5:We will help to arrange transportation dor you.If you want to use your own courier account pls kindly tell us before shipping out.
Q6:What's the lead time?
A6:Sample order costs 1~3 workdays and 3~5 workdays for production.
