| Place of Origin: | Guangdong,China |
|---|---|
| Certification: | ROHS,UL,REACH |
| Model Number: | M-TP300 |
| Minimum Order Quantity: | Negotiation |
| Price: | Negotiation |
| Packaging Details: | Packed in Carton |
| Delivery Time: | 3~7Days |
| Payment Terms: | T/T |
| Supply Ability: | 100000Pieces/Day |
| Color: | Blue,Grey | Material: | Silicone |
|---|---|---|---|
| Application: | High Voltage | Rated Voltage: | 6Kv/ac |
| Usage: | CPU,LED,Electronics Etc | Sample: | Freely Supplied |
| Product Name: | Factory Produce Thermal Pad Price | Size: | 200*400mm. Customized Accepted |
| High Light: | 3W/M.K thermal rubber pad,3g/cm3 thermal rubber pad,0.19Mpa Thermal Cooling Pad |
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3W/M.K High Conductivity Soft Gap Filler Silicone Thermal Pads For Heat Sink
Product Desrciption
Ultra-high thermal conductive silicone sheet is a high-performance heat conducting interface material made of 100% imported materials for filling the air gaps between the heating device and the heat sink or metal base. Its softness and elasticity characteristics enable it to be used for covering a very uneven surface. Heat is transferred from the separation device or the entire PCB to the metal casing or diffuser to improve heat dissipation and improve the efficiency of heating electronic components and service life.
Features & Benefits
Typical Applications
Physical Properties
Standard size:200mm×400mm,300mm×400mm;Customized size available
|
Product Name |
3W/M.K High Conductivity Soft Gap Filler Silicone Thermal Pads For Heat Sink |
|
Model |
M-TP300 |
|
Color |
Blue/Grey |
|
Thickness |
0.3~10.0mm |
|
Hardness |
40~80 |
|
Specific Gravity |
3g/cm3 |
|
Tensile Strength |
0.19Mpa |
|
Elongation |
40% |
|
Tear Strength |
0.9KN/m |
|
Breakdown Voltage |
≥10KV/mm |
|
Volume Resistivity |
1×1012Ω·cm |
|
Continuous Use Temp |
-40~200℃ |
|
Flame Rating |
V-0 |
|
Weight Loss |
≤0.3 |
|
Dielectric Constant |
7 |
|
Thermal Conductivity |
3W/m.k |
|
Shipping |
DHL/UPS/FedEx/Aramex/EMS/HK Post |
Product Details
Packaging & Shipping
Q1: What's the thermal conductivity test method given on the data sheet ?
