Material: | Thermal Interface Pad | Sample: | Free Sample |
---|---|---|---|
Tensile Strength: | Excellent | Usage: | Insulation Cooling,Electronics Etc |
Conductivity: | 1.0-10.0W/M-K | Size: | 200*400mm. Customized Accepted |
Thermal Conductivity: | 1.0W/m.k-6.0W/m.k | Dielectric Breakdown Voltage: | ≥200Vac/mil |
Highlight: | 4.0W/m.k thermal cooling pad,4.0W/m.k thermal interface material pad,200x400mm thermal cooling pad |
Blue High Thermal Performance Soft Silicone Battery Thermal Pad
Product Description
M-TP400 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
Applications
l Computer services: CPU, Heat sink, Memory modules
l LED Lighting, LCD-TV
l Military Electronics
l Power Supplies
l Telecom services, Wireless instruments
Physical Properties
Property |
M-TP400 |
Unit |
Tolerance |
Test Method |
Composition |
Filled silicone elastomer |
— | ||
Color |
Dark grey |
— |
— |
Visual |
Thermal conductive |
4.0 |
W/m.K |
±10% |
ASTM D5470 |
Thickness |
20~400(1mil=0.0254mm) |
mil |
±10% |
ASTM D374 |
0.5~10 |
mm |
ASTM D374 |
||
Hardness |
40-80 |
Shore 00 |
— |
ASTM D2240 |
Density |
3.1 |
g.cm-3 |
— |
— |
Temperature Range |
-40~+200 |
℃ |
— |
— |
Breakdown Voltage |
>3000(0.3mm~0.5mm) |
V |
— |
ASTM D149 |
>5000(>0.5mm) |
||||
Flame Rating |
UL 94 V-0 |
— |
— |
UL 94 |
Please contact us for other special requirements such as :
Product Details
Packaging & Shipping
Q1: What's the thermal conductivity test method given on the data sheet ?