| Place of Origin: | China |
|---|---|
| Certification: | ROHS,UL,REACH |
| Model Number: | LM-PCM |
| Minimum Order Quantity: | Negotiation |
| Price: | Negotiation |
| Packaging Details: | Packed in Carton |
| Delivery Time: | 3~7 Work days |
| Payment Terms: | T/T |
| Supply Ability: | 100000PCS/Day |
| Material: | Silicone | Application: | High Temperature, LED,CPU,TV,PCB,PC,PDP Chip Etc |
|---|---|---|---|
| Product Name: | Phase Change Gap Filler Material | Tensile Strength: | 10.4Mpa |
| Colour: | Customized(Grey, Etc) | Thickness: | 0.003"/0.005"/0.008"/0.010"MM |
| Conductivity: | 0.80-3.5W/M-K | Phase Change Temp: | 50~60 Degree Celsius |
| High Light: | 10.4Mpa phase change thermal pad,3.5W/M.K heat resistant silicone sheet,3.5W/M.K phase change thermal pad |
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Grey High PerformanceThermal Conductive Phase Change Gap Filler Material For CPU
Product description
LM-PCM phase change material is a heat reinforced polymer, designed to meet the Thermal conductivity and reliability demand for the thermal conductivity of high application terminal. In addition, the heat sink’s performance benefits a lot from the low heat resistance. And improve the microprocessor, DC - DC converter of memory module and the reliability of power module. Features : the material is solid in room temperature and installation is completely convenient,used between heat sink and devices. The material can be softened and flowing when the products reach phase-change temperature to fill the devices’ tiny irregular contact surface. Thus, the material has the ability to fill the gap between the devices and heat sink completely, make the phase change better than non-current elastomers or thermal graphite pad and get the performance of thermal conductive silicon grease. The material is nonconductive, however, as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material cannot be used as electrical insulating material.
Features and Benefits:
-LM-PCM series is solid at room temperature and is easy to handle during manufacturing, assembly.
-LM-PCM materials will be soften when reach to 55℃ of operating temperatures and flows to give the high thermal performance typical of thermal grease.
Typical Application:
-Micro Processor Unit
-Graphic Processor Unit
-Power Semiconductors
-Digital/High Power CPU's
Typical Properties of This Materials:
|
Item |
Product Numbers |
||||||
| Physical Property | Testing Standard | PCM010 | PCM020 | PCM030 | PCM040 | PCM050 | PCM060 |
|
Colour |
/ | blue | purple | Pink | Gray | Gray | Customiza |
|
Thickness(mm) |
ASTM D374 |
0.5-5.0 |
0.5-5.0 |
0.5-5.0 |
0.5-3.0 |
0.5-3.0 |
0.5-3.0 |
|
Density(g/cm³) |
ASTM D792 |
2.1 |
2.5 |
3 |
3.2 |
3.3 |
3.4 |
| Hardness(Shore 00) | ASTM D2240 |
30-80 |
30-80 |
30-80 |
30-80 |
40-80 |
40-80 |
| Volumetric Resistivity(Ω•cm) | ASTM D257 | >1×10ˆ13 | >1×10ˆ13 | >1×10ˆ13 | >1×10ˆ12 | >1×10ˆ12 | >1×10ˆ12 |
| Breakdown Voltage(Vac/mm) | ASTM D149 | >6000 | >6000 | >6000 | >6000 | >6000 | >6000 |
| Operating Temperature(℃) | / | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 |
| Thermal Conductivity(W/m.K) | ASTM D5470 | 1 | 2 | 3 | 4 | 5 | ≥6 |
| UL94 Flame Retardant Grade | UL94 | V0 | V0 | V0 | V0 | V0 | V0 |
Product details
How to transfer or dissipate the heat from the heat-generating components to heat sinks?
The key component in the heat exchange is the interfacial joint along with air between the heat sinks and electronic devices where uneven or rough textures are existing.
Air is a very poor thermal conductor and restricts the flow of heat from the heat generating component to the heat sinks. In order to get the best performance of the heat sink, as well as to keep the operating temperature of the component to a minimum, the air must be filled with Thermal Interface Materials(TIMs),which are the most compressible and highly conformable thermal fillers. As a result of its compressibility and ability to accommodate loose flatness tolerances, ourTIMs minimize the extreme stresses to components and eliminate the air-gaps to reduce the thermal resistance, as well as high conformability reduces interfacial resistance!
