Type: | Insulator | Application: | High Temperature |
---|---|---|---|
Color: | Grey/black/pink/yellow | Name: | Phase Change Material |
Thermal Conductivity: | 1.0W/M.K | Phase Transition Temperature: | Phase Transition Temperature |
Density: | 2.2g/cc | Tensile Strength: | Excellent |
High Light: | Microencapsulated Phase Change Materials,2.2g/cc organic pcm material,2.2g/cc bio based phase change materials |
High Frequency Microencapsulated Phase Change Materials Low Resistance -25℃ - 125℃
LM-PCM100 is low melting point thermal interface material. At 50℃, It begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.Also it is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
LM-PCM100 shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features:
> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Product Name
|
Thermal Resistance Phase Change pad
|
|
Item No.
|
PCM100
|
Test Method
|
Color
|
Pink
|
Visual
|
Main ingredients
|
Silica gel
|
***
|
Composite Thickness
|
0.010"
(0.254mm) |
***
|
Thickness Tolerance
|
±0.0012"
(±0.030mm) |
***
|
Density(g/cc)
|
2.2
|
***
|
Work temperature |
-25℃~125℃ |
***
|
phase transition temperature |
50℃~60℃ |
***
|
Setting temperature
|
70℃ for 5 minutes |
*** |
Thermal Conductivity(W/mK)
|
1.0 |
ASTM D5470
(modified) |
Service Temperature
|
-58 to 392 °F
-50oC ~ 200oC
|
***
|
Features and Benefits
|
-1.0 W/mk thermal conductivity
-Phase change at 5 50℃ ~ 65℃ -Naturally tacky at room temperature -No preheating required |
Product Details
Package And Shipping
Q:What’s the thermal conductivity test method given on the data sheet?
A: All the data in the sheet are tested out by the third party. ASTM D5470 is utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for your application?
A: It depends on the watts of power source, ability of heat dissipation. For any customers, please contact us for the technical support.
Q: Are thermal pads offered with tacky?
A: Yes, all the thermal pads have its inherent tacky. All the models are natural tacky for two sides, except for the LCP series ,only one side has natural tacky. LCB series thermal pads can be cover 3M glue with strong
adhesive.
Q: Are thermal pads reworkable?
A: It’s depend on the application and the pad being used. Thermal pads have been reused before, however,it’s up to the judgment of product designer, to see whether the pads could withstand reuse.
Q:Will the heat make the thermal pads softer?
A: ShoreC 20~80 ,there is no significant change in the hardness of thermal pads, as gap filler.
Q: What’s the tolerance for the thickness?
A :Normally ±0.1mm.
Q: Are the thermal pads electrical insulating?
A: Yes, all thermal pads are electrically isolated.
Q: What’s the shelf life for thermal pads?
A: Shelf life for thermal pad is one year after the date of manufacture. For the pads with adhesive, the shelf life is 6months after the date of manufacture. After these dates, all the characters should be retested.
Q: Can the thermal pads be with fiberglass?
A: YES, we could have thermal pads with fiberglass center to improve customer specific requirements for the tensile strength.LCP series has fiberglass on its surface, all other models will be made at your requirement.