Material: | Other | Colour: | Gray |
---|---|---|---|
Thermal Conductivity: | 2.0 W/mk | Density: | 1.2g/cm2 |
Storage Temp: | <40℃ | Storage Time: | 12Month |
Thermal Impedance: | 0.035 ℃in2/w | Thickness: | 0.13/0.18/0.2/0.25 Mm |
Highlight: | 0.2mm thickness Thermal Conductive Sheet,2.0w/m.k Thermal Cooling Pad,0.2mm thickness Thermal Cooling Pad |
Thermal Impedance 0.035 ℃in2/w Phase Change Material Products PCM Materials
The material is heat reinforced polymer, designed to meet the Thermal conductivity and reliability demand for the thermal conductivity of high application terminal. In addition, the heat sink’s performance benefits a lot from the low heat resistance. And improve the microprocessor, DC - DC converter of memory module and the reliability of power module.The phase change characteristics: the material is solid in room temperature and installation is completely convenient,used between heat sink and devices. The material can be softened and flowing when the products reach phase-change temperature to fill the devices’ tiny irregular contact surface. Thus, the material has the ability to fill the gap between the devices and heat sink completely, make the phase change better than non-current elastomers or thermal graphite pad and get the performance of thermal conductive silicon grease. The material is nonconductive, however, as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material can not be used as electrical insulating material.
Advantage
Low thermal resistance under low pressure
Inherent viscosity, easy to use and not need to use the adhesive
No need preheating the radiator
Flow but not silicone oil
Low volatility -- less than 1%
Phisical properties
Test item |
Unit |
BC-A |
BC-B |
BC-P |
BC-Y |
---|---|---|---|---|---|
color |
- |
Gray |
Black |
Pink |
Yellow |
Carrier |
- |
- |
Aluminum foil |
- |
- |
Thermal impedance |
℃in2/w |
0.035 |
0.03 |
0.05 |
0.05 |
Thermal conductivity |
w/m-k |
2.5 |
2.5 |
1.0 |
1.0 |
Phase change temp |
℃ |
50~60 |
50~60 |
50~60 |
50~60 |
Density |
g/cm2 |
1.2 |
2.2 |
1.3 |
1.35 |
Thickness |
mm |
0.13/0.18/0.2/0.25 |
0.18 |
0.127 |
0.127 |
Storage temp |
℃ |
<40 |
<40 |
<45 |
<45 |
Temp range |
℃ |
-45~125 |
-45~125 |
-45~125 |
-45~125 |
Storage temp |
Month |
12 |
24 |
12 |
12 |
Product Details
Package And Shipping
Q:What’s the thermal conductivity test method given on the data sheet?
A: All the data in the sheet are tested out by the third party. ASTM D5470 is utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for your application?
A: It depends on the watts of power source, ability of heat dissipation. For any customers, please contact us for the technical support.
Q: Are thermal pads offered with tacky?
A: Yes, all the thermal pads have its inherent tacky. All the models are natural tacky for two sides, except for the LCP series ,only one side has natural tacky. LCB series thermal pads can be cover 3M glue with strong
adhesive.
Q: Are thermal pads reworkable?
A: It’s depend on the application and the pad being used. Thermal pads have been reused before, however,it’s up to the judgment of product designer, to see whether the pads could withstand reuse.
Q:Will the heat make the thermal pads softer?
A: ShoreC 20~80 ,there is no significant change in the hardness of thermal pads, as gap filler.
Q: What’s the tolerance for the thickness?
A :Normally ±0.1mm.
Q: Are the thermal pads electrical insulating?
A: Yes, all thermal pads are electrically isolated.
Q: What’s the shelf life for thermal pads?
A: Shelf life for thermal pad is one year after the date of manufacture. For the pads with adhesive, the shelf life is 6months after the date of manufacture. After these dates, all the characters should be retested.
Q: Can the thermal pads be with fiberglass?
A: YES, we could have thermal pads with fiberglass center to improve customer specific requirements for the tensile strength.LCP series has fiberglass on its surface, all other models will be made at your requirement.