Application: | High Temperature, LED,CPU,TV,PCB,PC,PDP Chip Etc | Material: | Silica Gel Thermal |
---|---|---|---|
Tensile Strength: | 5.88Mpa | Hardness: | 18±5~40±5 Shore C |
Thickness: | 0.3-20mm | Conductivity: | 1.0-10.0W/M-K |
Density (g/cm3): | 1.4-3.1 | ||
High Light: | ROHS Thermal Conductive Silicone Pad,Self Adhesive thermal silicone pad,10.0W/M.K thermal silicone pad |
Insulation Heat Dissipation Environmental Self Adhesive Thermal Conductive Silicone Pad
Product Description
About conduct:
Thermal interface silicone material is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving. With nice stickiness,flexibility, good compression performance and excellent heat conductivity designed for it,it makes the
products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.
Physical Properties
Standard size:200mm×400mm,300mm×400mm;Customized size available;
Property |
M-TP |
Unit |
Tolerance |
Test Method |
Composition |
Filled silicone elastomer |
— |
||
Color |
Purple/Pink/Grey/Blue |
— |
— |
Visual |
Thermal conductive |
1.0~10 |
W/m.K |
±10% |
ASTM D5470 |
Thickness |
20~400(1mil=0.0254mm) |
mil |
±10% |
ASTM D374 |
0.5~10 |
mm |
ASTM D374 |
||
Hardness |
40-80 |
Shore 00 |
— | ASTM D2240 |
Density |
1.4-3.1 |
g.cm-3 |
— |
— |
Temperature Range |
-40~+200 |
℃ |
— |
— |
Breakdown Voltage |
>3000(0.3mm~0.5mm) |
V | — | ASTM D149 |
>5000(>0.5mm) |
||||
Flame Rating |
UL 94 V-0 |
— |
— |
UL 94 |
Dielectric Constant |
12.6 |
MHz |
— |
ASTM D150 |
Product Details
Product Usage
Q1: What's the thermal conductivity test method given on the data sheet ?