Material: | Silicone | Color: | White,Blue,Pink,Grey |
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Type: | Silicone Thermal Pad | Application: | High Temperature,CPU,LED,Other |
Thermal Conductivity: | 1.0W/m.k-6.0W/m.k | Tensile Strength: | Excellent |
Thickness: | 0.25mm~15mm | Size: | According To Customer Needs |
High Light: | 6W/MK Thermal Conductive Pad,High Temperature Thermal Conductive Pad,Silicone soft thermal pads |
Die-Cuting 1-6W/MKSilicone Thermal Heating Conductive Pads For GPU CPU Heatsink
Product Description
1.Thermal Conductive Silicon Pad is a kind of thermal interface with high performance. It is soft, self-sticky and elastic.
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2.It can fill the gap between heat-generating components and heat sink, metal mechanism and shell or other cooling devices.
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3.The heat can be transferred out speedily so as to improve the electronic components' working efficiency and prolong the life-span of equipments.
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Features
* Thermal Conductivity: 2.0W/m-k
* Tear resistant, soft and conformable
* Excellent electrical insulation
Physical Properties
Property |
Test Value | Test Method |
Reinforced Carrier |
Fiberglass | ----- |
Pad Type |
Silicone Polymer | ----- |
Thickness(mm) |
0.30~1.00 | ASTM D374 |
Color |
Light Blue | VISUAL |
Density(g/cc) |
2.1 | ASTM D792 |
Hardness(Shore C) |
25±5 | ASTM D2240 |
Thermal Conductivity(W/m-k) |
2.0 | ASTM D2240 |
Voltage Resistance(KV/mm) |
>4.0 | ASTM D149 |
Temperature Resistance(℃/℉) |
-40~+220(℃) | ASTM D5470 |
Volume Resistance(Ω .cm) |
5.0*1013 | ASTM D257 |
Flame Rating |
V-0 | UL-94 |
Note: The above technical information and data should be considered representative or typical only and should not be used for specification purposes.
Shelf Life
Product shelf life is 2 years from date of manufacture when stored at room temperature conditions (72°F [22°C] and 50% RH) in the products original packaging.
Available Sizes
Width: Can be Customized
Length: Can be customized
Custom Sizes: If you need customized sizes or die cut parts please feel free to contact NKS sales representative.
Product Description
Packaging & Shipping
Q1: What's the thermal conductivity test method given on the data sheet ?