products

2Kgf/Cm2 4W/M.K Silicone Free Thermal Pad For CPU

Basic Information
Place of Origin: China
Certification: ROHS,REACH,UL
Model Number: LM-NG400
Minimum Order Quantity: Negotiation
Price: Negotiation
Packaging Details: Packed in Carton
Delivery Time: 3~7 Days
Payment Terms: T/T
Supply Ability: 1000000PCS/Day
Detail Information
Thickness: 0.5~5.0mm Weight Loss: <1%
Working Temperature: -30~+125 Degree Celsius Application: High Temperature
Tensile Strength: 2 Kgf/cm2 Hardnss: 60 Shore 00
Flame Rating: UL 94 V-0 Density: 2.5 G/cm3
High Light:

4W/m.K silicone free thermal pad

,

4W/m.K thermally conductive gap pad

,

2Kgf/cm2 thermally conductive gap pad


Product Description

Hardnss 60 Shore C 4W/mK Thermal Conductive Silicone-Free Gap Filler Pad For CPU
 
 
Product Description
 
   LM-NG400 thermal conductive silicone-free gap filler pad, no silicone oil, no pollution, no oil leakage during long-termhigh-temperature use, especially suitable for heat dissipation of components sensitive to silicone oil. Silicon-free thermal conductive pads have good self-adhesiveness, excellent aging resistance, and high flexibility, so they are widely used in optical precision equipment, security, high-end industrial control and medical electronics, automotive engine control equipment, and high-definition cameras And other high-end electronic and electrical industries.

Features

Low contact thermal impedance

Good thermal conductivity

Silicone free

Long term stability

REACH Compliant

RoHS Compliant

 

Applications

 

Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat Sink,

LCD-TV, Notebook PC, PC, Telecom Device, Wireless Hub…..etc

DDR ll Module, DVD Applications, Hand-set applications…..etc

 

Properties

 

 

Properties

LM-NG400 Unit Tolerance Test Method

 

Color

Grey - - Visual

 

Thickness

0.5~5.0 mm - ASTM D374

 

(the thickness can be ordered)

0.0197~0.1969 inch - ASTM D374

 

Thermal Conductivity

4 W/m.k ±0.4 ASTM D5470

 

Flame Rating

V-0 - - -

 

Dielectric Breakdown Voltage

10 kV/mm - ASTM D149

 

Weight Loss

<1 % - ASTM E595

 

Density

2.5 g/cm3 ±0.2 ASTM D792

 

Working Temperature

-30~+125 °C - -

 

Volume Resistance

>1010 Ohm-m - ASTM D257

 

Elongation

100 % - ASTM D412

 

Tensile Strength

2 Kgf/mm2 - ASTM D412

 

Standard Shape

Sheet ones - - -

 

Hardness

60 Shore 00 ±10 ASTM D2240

 

Configurations available: 200mm*400mm, specific size could be provided according to your requirement

 

Product Details

2Kgf/Cm2 4W/M.K Silicone Free Thermal Pad For CPU 02Kgf/Cm2 4W/M.K Silicone Free Thermal Pad For CPU 1

 
Packing & Shipping
2Kgf/Cm2 4W/M.K Silicone Free Thermal Pad For CPU 2
FAQ
 
Q1: What thermal conductivity test method was used to achieve the values given on the data sheets?
A1: A test fixture is utilized that meets the specifications outlined
in DRL-III.

Q2: Is GAP PAD offered with an adhesive?
A2: Currently, All GAP PAD Materials have inherent tack.

Q3: Is the adhesive reuse?
A3: Depending on the surface being applied to, if care is taken, the pad may be reuse. Special care should be taken.When removing
the pad from aluminum or anodized surfaces to avoid tearing or delamination.

Q4: What is meant by “natural tack”?
A4: The characteristic of the rubber itself has a natural inherent tack, with the addition of an adhesive. As with adhesive backed
products, the surfaces with natural tack may help in the assembly process to temporarily hold the pad in place while the
application is being assembled. Unlike adhesive backed products, inherent tack does not have a thermal penalty since the rubber
itself has the tack. Tack strength varies from one GAP PAD product to the next.

Q5: Can GAP PAD with natural tack be repositioned?
A5: Depending on the material that the pad is applied to, in most cases they are repositionable. Care should be taken when
removing the pad from aluminum or anodized surfaces to avoid tearing or delaminating the pad. The side with the natural tack is
always easier to reposition than an adhesive side.

Q6: Is GAP PAD reworkable?
A6: Depending on the application and the pad being used, GAP PAD has been reworked in the past. Some of our customers are
currently using the same pad for reassembling their applications after burn-in processes and after fieldwork repairs. However,this
is left up to the design engineer’s judgment as to whether or not the GAP PAD will withstand reuse.

Q7: Will heat make the material softer?
A7: From -40°C to 200°C, there is no significant variance in hardness for silicone GAP PAD Materials and Gap Fillers.

Q8: What is the shelf life of GAP PAD?
A8: Shelf life for most GAP PAD Materials is ten (10) year after the date of manufacture. For GAP PAD with adhesive, the shelf
life is two (2) years from the date of manufacture. After these dates, inherent tack and adhesive properties should be
recharacterized. The GAP PAD material’s long-term stability is not the limiter on the shelf life; it is related to the adhesion or
“age up” of the GAP PAD to the liner. Or in the case of a GAP PAD with adhesive, the shelf life is determined by how the adhesive
ages up to the removable liner.
Q9: How is extraction testing performed?
A9: The test method used is the Soxhlet Extraction Method;

Q10: What is the thickness tolerance of your pads?
A10: The thickness tolerance is ±0.2mm on materials .

Q11: What are the upper processing temperature limits for GAP PAD and for how long can GAP PAD be exposed to them?
A11: GAP PAD in general can be exposed to temporary processing temperatures of 120°C.Time base on GAP PAD thickness, assembly line
14 meters long,time about 10-15 minutes .

Q12: Is GAP PAD electrically isolating?
A12: Yes, all GAP PAD materials are electrically isolating. However, keep in mind that GAP PAD is designed to fill gaps and it is
not recommended for applications where high mounting pressure is exerted on the GAP PAD.

Q13: Why are “wet out,” “compliance” or “conformability” characteristics of GAP PAD important?
A13: The better a GAP PAD lays smooth “wets out” or conforms to a rough or stepped surface, giving less interfacial resistance
caused by air voids and air gaps. GAP PAD Materials are conformable or compliant as they adhere very well to the surface. The GAP
PAD Materials can act similarly to a “suction cup” on the surface.
This leads to a lower overall thermal resistance of the pad between the two interfaces.

Q14: Is anything given off by the material (e.g., extractables, outgassing)?
A14: Silicone GAP PAD and Gap Fillers, like all soft silicone materials, can extract low molecular weight silicone .Also note that
GAP PAD and Gap Filler have some of the lowest extraction values for silicone-based gap filling products on the market and if
yourapplication requires minimal silicone, see our line of silicone-free material. The White Paper on GAP PAD S-Class and
information about our silicone-free materials are available on our website.

Q15: Why does the Technical Data Sheet describe the Shore hardness rating as a bulk rubber hardness?
A15: A reinforcement carrier is generally used in BERGQUIST GAP PAD Materials for ease of handling. When testing hardness, the
reinforcement carrier can alter the test results and incorrectly depict thinner materials as being harder. To eliminate this
error, a 250 mil rubber puck is molded with no reinforcement carrier. The puck is then tested for hardness. The Shore hardness is
recorded after a 30-second delay.

Contact Details
sales

Phone Number : +8613560312553

WhatsApp : +8613560312553