Application: | Low Voltage,HID Ballast, ECU, UPS | Tensile Strength: | 8 Kg/cm2 |
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Continuous Use Temp: | -40~220 ℃ | Voltage Endu Ance: | >5KV |
Conductivity: | 6.0w/m-k | Hardness: | 20~80 Shore C |
Flame Rating: | 94-V0 | Color: | Grey And Laterite Etc |
High Light: | 8kg/cm2 GPU Thermal Pad,6.0w/m.k thermally conductive gap filler,6.0w/m.k heat dissipation pad |
The NG series high performance, thermal conductive pad designed with extremely high thermal conductivity and fitting performance, which is from the boron nitride powder of the raw material compound, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.
Communication hardware equipment
High-speed hard disk drive equipment
Automobile engine control mould
Micro processor, memory chip and graphics processor
Mobile equipment
Phisical Properties
Phisical Properties
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test item
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test method
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unit
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NG600 value
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NG500 value
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color
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visual
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|
Grey
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Blue/Yollow
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thickness
|
ASTM D374
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mm
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0.25~10
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0.25~10
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specific gravity
|
ASTM D792
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g/ cm3
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2.85
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2.7
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hardness
|
ASTM D2240
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shore C
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20~80
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20~80
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continuous use temp
|
EN344
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℃
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-40~220
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-40~220
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voltage endu ance
|
ASTM D149
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KV/mm
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>5.0
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>5.0
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flame rating
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UL-94
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|
94-V0
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94-V0
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conductivity
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ASTM D5470
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w/m-k
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6.0
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5.0
|
1) High compressibility, soft and flexible, designed for applications in low-stress application environment .
2) Nice thermal conductivity .
3) Electrical insulation .
4) Meet with the environmental requirements of ROHS and UL .
5) Natural stickiness .
Product Details