Processing Service: | Cutting | Thermal Impedance: | 0.18℃in2/W |
---|---|---|---|
Hardness: | Shore00 60 | Product Keywords: | Heatsink Silicon-free Thermal Pad Thermal Conductivity |
Plastic Modling Type: | Casting | Thermal Conductivity: | 4.5W/mK |
Dielectric Strength: | 10kV/mm | Color: | Customed |
Highlight: | 4.5W/m.K silicon free thermal pad,60 Shore00 thermal interface pad,4.5W/m.K heatsink thermal pad |
-No siloxane volatization
-No silicone oil seeping
-High thermal conductive
-Flexibility, High compression ratio
-Good fire retardant property
-Good electrical insulating performance
-High tensile strength, High elongation
Applications
-heat sink
-Optical precision equipment
-Notebook PC
-Mobile and telecommunications equipment
-Automotive engine control equipment
-High-end industrial control and medical electronics
Properties
Thermal conductivity |
4.5W/mK |
Thermal impedance |
0.18℃in2/W |
Dielectric strength |
10kV/mm |
Hardness |
Shore00 60 |
Size |
200*400*1.0 |
Product Keywords |
heatsink silicon-free thermal pad thermal conductivity |
Product Details