Color: | Red | Application: | High Temperature |
---|---|---|---|
Thickness: | 0.25mm~15mm | Thermal Conductivity: | 0.8-9.2W/(m.K) |
Usage: | Insulation Cooling,CPU,LED,Laptop,Electronics Etc | Sample: | Sample Avaliable |
Flame Rating: | 94 V-0 | Product Name: | Thermal Conductive Pads |
High Light: | 2.4g/cc thermal cooling pad,25 shore C adhesive thermal pad,2.4g/cc thermal gap pad |
Thermal silicone free material is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving.
With nice stickiness,flexibility, good compression performance and excellent heat conductivity designed for it,it makes the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.
Application mode
1. Fill between the circuit board and thermal slug
2. Fill between IC and thermal slug or the product shell
3. Fill between IC and heat dissipation material ( such as metallic shield)
Product application
Thermal silicone free pad is widely used for all kinds of high power supply, laptop, LED light, smartphone, power battery, electronic industry and so on.
Physics parameter form
Test Item |
Test Method |
Unit |
CP200 Value |
Color |
Visual | Red | |
Thickness |
ASTM D374 | mm | 0.15~20 |
Specific Gravity |
ASTM D792 | g/cc | 2.4±0.1 |
Hardness |
ASTM D2240 | Shore C | 25±5 |
Tensile Strength |
ASTM D412 | (Pa) | 5.7*108 |
Compressibility |
ASTM D412 | % | 30 |
Temperature Range |
EN344 | ℃ | -40~+150 |
Volume Resistivity |
ASTM D257 | Ω-CM | 1.0*10^11 |
Breakdown Voltage |
ASTM D149 | KV/mm | 4 |
Flame Rating |
UL-94 | V-0 | |
Thermal Conductivity |
ASTM D5470 | w/m-k | 2.0 |
Product Details