25 Shore C 2.4g/Cc Thermally Conductive Gap Pad For Laptop

Basic Information
Place of Origin: China
Certification: ROHS,REACH,UL
Model Number: LM-NG300
Minimum Order Quantity: Negotiation
Price: Negotiation
Packaging Details: Packed in Carton
Delivery Time: 3~7 Days
Payment Terms: T/T
Supply Ability: 1000000PCS/Day
Detail Information
Color: Red Application: High Temperature
Thickness: 0.25mm~15mm Thermal Conductivity: 0.8-9.2W/(m.K)
Usage: Insulation Cooling,CPU,LED,Laptop,Electronics Etc Sample: Sample Avaliable
Flame Rating: 94 V-0 Product Name: Thermal Conductive Pads
High Light:

2.4g/cc thermal cooling pad


25 shore C adhesive thermal pad


2.4g/cc thermal gap pad

Product Description

Thermal Conductive Cool Silicone Free Gap Pad For High Temperature
Product Description

Thermal silicone free material is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving.

With nice stickiness,flexibility, good compression performance and excellent heat conductivity designed for it,it makes the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.


Application mode


1. Fill between the circuit board and thermal slug

2. Fill between IC and thermal slug or the product shell

3. Fill between IC and heat dissipation material ( such as metallic shield)


Product application


Thermal silicone free pad is widely used for all kinds of high power supply, laptop, LED light, smartphone, power battery, electronic industry and so on.


Physics parameter form



Test Item


Test Method




CP200 Value



Visual   Red



ASTM D374 mm 0.15~20


Specific Gravity

ASTM D792 g/cc 2.4±0.1



ASTM D2240 Shore C 25±5


Tensile Strength

ASTM D412 (Pa) 5.7*108



ASTM D412 % 30


Temperature Range

EN344 -40~+150


Volume Resistivity

ASTM D257 Ω-CM 1.0*10^11


Breakdown Voltage

ASTM D149 KV/mm 4


Flame Rating

UL-94   V-0


Thermal Conductivity

ASTM D5470 w/m-k 2.0


Product Details

25 Shore C 2.4g/Cc Thermally Conductive Gap Pad For Laptop 0

25 Shore C 2.4g/Cc Thermally Conductive Gap Pad For Laptop 1

25 Shore C 2.4g/Cc Thermally Conductive Gap Pad For Laptop 2
Q1: What thermal conductivity test method was used to achieve the values given on the data sheets?
A1: A test fixture is utilized that meets the specifications outlined

Q2: Is GAP PAD offered with an adhesive?
A2: Currently, All GAP PAD Materials have inherent tack.

Q3: Is the adhesive reuse?
A3: Depending on the surface being applied to, if care is taken, the pad may be reuse. Special care should be taken.When removing
the pad from aluminum or anodized surfaces to avoid tearing or delamination.

Q4: What is meant by “natural tack”?
A4: The characteristic of the rubber itself has a natural inherent tack, with the addition of an adhesive. As with adhesive backed
products, the surfaces with natural tack may help in the assembly process to temporarily hold the pad in place while the
application is being assembled. Unlike adhesive backed products, inherent tack does not have a thermal penalty since the rubber
itself has the tack. Tack strength varies from one GAP PAD product to the next.

Q5: Can GAP PAD with natural tack be repositioned?
A5: Depending on the material that the pad is applied to, in most cases they are repositionable. Care should be taken when
removing the pad from aluminum or anodized surfaces to avoid tearing or delaminating the pad. The side with the natural tack is
always easier to reposition than an adhesive side.

Q6: Is GAP PAD reworkable?
A6: Depending on the application and the pad being used, GAP PAD has been reworked in the past. Some of our customers are
currently using the same pad for reassembling their applications after burn-in processes and after fieldwork repairs. However,this
is left up to the design engineer’s judgment as to whether or not the GAP PAD will withstand reuse.

Q7: Will heat make the material softer?
A7: From -40°C to 200°C, there is no significant variance in hardness for silicone GAP PAD Materials and Gap Fillers.

Q8: What is the shelf life of GAP PAD?
A8: Shelf life for most GAP PAD Materials is ten (10) year after the date of manufacture. For GAP PAD with adhesive, the shelf
life is two (2) years from the date of manufacture. After these dates, inherent tack and adhesive properties should be
recharacterized. The GAP PAD material’s long-term stability is not the limiter on the shelf life; it is related to the adhesion or
“age up” of the GAP PAD to the liner. Or in the case of a GAP PAD with adhesive, the shelf life is determined by how the adhesive
ages up to the removable liner.
Q9: How is extraction testing performed?
A9: The test method used is the Soxhlet Extraction Method;

Q10: What is the thickness tolerance of your pads?
A10: The thickness tolerance is ±0.2mm on materials .

Q11: What are the upper processing temperature limits for GAP PAD and for how long can GAP PAD be exposed to them?
A11: GAP PAD in general can be exposed to temporary processing temperatures of 120°C.Time base on GAP PAD thickness, assembly line
14 meters long,time about 10-15 minutes .

Q12: Is GAP PAD electrically isolating?
A12: Yes, all GAP PAD materials are electrically isolating. However, keep in mind that GAP PAD is designed to fill gaps and it is
not recommended for applications where high mounting pressure is exerted on the GAP PAD.

Q13: Why are “wet out,” “compliance” or “conformability” characteristics of GAP PAD important?
A13: The better a GAP PAD lays smooth “wets out” or conforms to a rough or stepped surface, giving less interfacial resistance
caused by air voids and air gaps. GAP PAD Materials are conformable or compliant as they adhere very well to the surface. The GAP
PAD Materials can act similarly to a “suction cup” on the surface.
This leads to a lower overall thermal resistance of the pad between the two interfaces.

Q14: Is anything given off by the material (e.g., extractables, outgassing)?
A14: Silicone GAP PAD and Gap Fillers, like all soft silicone materials, can extract low molecular weight silicone .Also note that
GAP PAD and Gap Filler have some of the lowest extraction values for silicone-based gap filling products on the market and if
yourapplication requires minimal silicone, see our line of silicone-free material. The White Paper on GAP PAD S-Class and
information about our silicone-free materials are available on our website.

Q15: Why does the Technical Data Sheet describe the Shore hardness rating as a bulk rubber hardness?
A15: A reinforcement carrier is generally used in BERGQUIST GAP PAD Materials for ease of handling. When testing hardness, the
reinforcement carrier can alter the test results and incorrectly depict thinner materials as being harder. To eliminate this
error, a 250 mil rubber puck is molded with no reinforcement carrier. The puck is then tested for hardness. The Shore hardness is
recorded after a 30-second delay.

Contact Details

Phone Number : +8613560312553

WhatsApp : +8613560312553